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Monday, October 26, 2026

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Merger Monday & Election Implications

EQT’s $50 billion merger with Range Resources and Ovintiv’s $1.26 billion acquisition of Logan Energy reshape North American oil and gas alongside Brazil and British Columbia election…

EQT $34BRRC $13B
Bison Insights 7 clicks

From X

@convequity

Convequity on X

Huawei's finer bonding deserves more weight in the AI-chip race. $AVGO's 3.5D approach combines vertically stacked dies with the side-by-side packaging used to connect processors and HBM. It adds another direction in which designers can shorten the wires moving data around a chip. Besi describes Broadcom's initial face-to-face hybrid bonding at 6µm pitch. Huawei reports 1.5µm for its 2026 Kirin implementation. Pitch is the spacing between connections; face-to-face brings the dies' wiring surfaces together. On an identical square grid, that spacing difference allows 16x as many potential bond sites per unit area. Usable connections still depend on routing and the space reserved for power and repair. It is an architectural opportunity, not a bandwidth multiple. The size qualification matters. Kurnal's Kirin 9050 die shots measure roughly 121mm² per die. Extending fine-pitch bonding to much larger AI dies changes the economics: more expensive silicon is at risk when a stack fails, and heat and power delivery have to work across the whole assembly. Broadcom also said face-to-face compute SoC shipments began in February 2026. A later roadmap cannot be read as its first arrival at face-to-face bonding. Huawei looks ahead on this published pitch comparison. Our view is that this gives it a credible route to narrowing parts of the AI-chip gap through packaging. The stronger claim needs production evidence at large accelerator scale. The phone result alone does not establish when that arrives. Builds on Convequity's Huawei After Sanctions, Parts 1–2, 10 & 18 Sep 2026, with updated source checks.
@convequity

Convequity on X

$NTSK began as a CASB vendor, governing how employees use SaaS applications at the point of use. Years of that work gave it application-specific knowledge of user behavior, data movement, and risk inside cloud apps. That knowledge carries over to AI. Netskope inspects prompts, responses, and file transfers inline and in real time, and it can respond with something more precise than a block: preventing a risky copy-and-paste, stepping up authentication for a sensitive interaction, or coaching the user as they work. The part that matters more comes after the prompt. AI adds autonomy and chaining, so a single human interaction can trigger many machine-executed actions across tools, data stores, and services, often outside one user session. If data is over-permissioned and tools are loosely scoped, an agent can stay inside its allowed permissions and still cause harm faster than a person can intervene. The context Netskope gathers at the interaction can be carried forward to constrain that downstream execution: who the user is, what data is involved, which action was taken, and how risky it looks. So Netskope's edge is that it already knows the user, the data and the action at the moment of the prompt, and it can use that context to limit what an agent does next. It is now building the agent side directly. Its Agentic Broker rates agent actions by risk before they run, and its AI posture management for agents built on AWS, Azure and GCP is still in preview. That is the part to watch.

Investor Letters

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Molina & Kinsale

Molina Healthcare and Kinsale Capital’s earnings are reassessed through a long-term lens, emphasizing conviction and detachment during…

MOH $11B
Bearstone 8 clicks

“Our Strategy Is Unchanged”

Netflix’s $51 billion FY26 revenue outlook and global streaming scale underpin its core strategy as management addresses slowing…

NFLX $511B
TSOH Investment Research 7 clicks
DLTR · long

Dollar Tree INC

Dollar Tree is long after divesting Family Dollar, separating its stronger banner from its weaker business.

DLTR $23B
Value Investors Club

Tower Semiconductor Deep Dive

Tower Semiconductor’s low-loss photonics chips halve lasers in 1.6T optical modules, supporting a $680 million annualized photonics run…

TSEM $19B
CV's Substack 10 clicks

Deep Dive: $ASML

ASML’s €230 million EUV machines underpin advanced AI chip production, with demand booked through 2028 after nearly $9 billion and two…

ASML $631B
Rebound Capital 8 clicks

Margin Call

Petrobras’s Morpho-1 well revived hopes that Brazil’s Equatorial Margin can become a major new oil frontier after hydrocarbons were…

PBR $83B
Doomberg 12 clicks

Our Views on CoreWeave

CoreWeave's financial statements point to a business model familiar to the authors after a closer review of the AI infrastructure company.

CRWV $34B
WHAT ARE WE DOING? “Contrarians At The Gate” 12 clicks

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