Bullpen.News From Edwin Dorsey
Get Daily Recap Feedback

Saturday, November 7, 2026

Back to the front page

From X

@convequity

Convequity on X

Huawei's finer bonding deserves more weight in the AI-chip race. $AVGO's 3.5D approach combines vertically stacked dies with the side-by-side packaging used to connect processors and HBM. It adds another direction in which designers can shorten the wires moving data around a chip. Besi describes Broadcom's initial face-to-face hybrid bonding at 6µm pitch. Huawei reports 1.5µm for its 2026 Kirin implementation. Pitch is the spacing between connections; face-to-face brings the dies' wiring surfaces together. On an identical square grid, that spacing difference allows 16x as many potential bond sites per unit area. Usable connections still depend on routing and the space reserved for power and repair. It is an architectural opportunity, not a bandwidth multiple. The size qualification matters. Kurnal's Kirin 9050 die shots measure roughly 121mm² per die. Extending fine-pitch bonding to much larger AI dies changes the economics: more expensive silicon is at risk when a stack fails, and heat and power delivery have to work across the whole assembly. Broadcom also said face-to-face compute SoC shipments began in February 2026. A later roadmap cannot be read as its first arrival at face-to-face bonding. Huawei looks ahead on this published pitch comparison. Our view is that this gives it a credible route to narrowing parts of the AI-chip gap through packaging. The stronger claim needs production evidence at large accelerator scale. The phone result alone does not establish when that arrives. Builds on Convequity's Huawei After Sanctions, Parts 1–2, 10 & 18 Sep 2026, with updated source checks.
@aleabitoreddit 2 clicks

Serenity on X

$CCXI looks like it's going public Q4 2026. And my hope is that it sort of looks like $OKLO if they generate enough excitement. Watched the investor presentation the other day, just waiting for the public listing anytime soon (I personally added some the other day). Big fan of humanoids, pretty confident physical AI shift is coming next. I'm personally not looking too much about the price action while it's in its filing phase, fun usually begins after ticker change. We'll see what happens

Investor Letters

All letters

Post Q3 EVC Update

EVC's Q3 update cites $30 million for a single station, a broadcast-business sale and stronger positioning for 2027.

EVC $832M
Nat Stewart - Stock Picking Newsletter 23 clicks

Entravision Q3 Update

Entravision’s Q3 ad-tech revenue reached $177.2 million, up 133% year over year, while total revenue rose 88% to $226.3 million and diluted…

EVC $832M
The Value Road 4 clicks

Axon 3Q26 Business Update

Axon cut full-year guidance after delayed federal Dedrone contracts slowed 3Q revenue growth to 28%, while software and services grew 43%.

AXON $31B
Speedwell Memos 4 clicks

AMD Q3 FY26, Annotated

AMD's Q3 revenue rose 45% to $13.4 billion as data center reached $8.5 billion, 64% of sales, driven by EPYC and Instinct ramps.

AMD $660B
Chipstrat 2 clicks

GREAT DEC-TECTIVE WORK

Diversified Energy reported $255.6 million of “true” nine-month free cash flow, while its $1.8 billion Birch acquisition would shift…

DEC $900M
The Oak Bloke 3 clicks

Publications we follow

Every publication on this site, hand-picked.

129 publications

Newsletters 109

YouTube 4

Blogs 15

Seeking Alpha 75 of 279

Nominate a publication

X accounts we follow

Every account on this site, hand-picked.

91 accounts
Nominate an account

Investor letters we follow

359 firms

Sectors

Ordered by how often our editor reaches for them.