ASML Is Building a Hybrid Bonding Tool!
ASML’s patent filings point to a track-based die-to-wafer hybrid bonding tool that could challenge Besi in advanced logic packaging.
ASML’s patent filings point to a track-based die-to-wafer hybrid bonding tool that could challenge Besi in advanced logic packaging.
“We’re not a widget factory… we’re a high alpha company.” Wait, what? $OPEN https://t.co/GuBhSn0Gvp
Keith Rabois belongs in jail. $OPEN https://t.co/NO4rrL3URv
@rabois @MarkNeuman18 @HHGF99 $OPEN
$DELL down 20% in the last 2 days. If things get any worse we might have a Scott’s Tots situation on our hands https://t.co/GWR20XOft9
$CRWV CDS spreads hit new highs today, pricing in over a 60% chance of default within the next 5 years per bbg https://t.co/ABpSnUk8az
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