Thursday, October 29, 2026

Back to today

Another Haircut with Avy the Barber

SoFi’s stock case hinges on interest rates, tangible book value and private-credit loan sales after its $1.5 billion equity offering.

From X

@convequity

Convequity on X

Huawei's finer bonding deserves more weight in the AI-chip race. $AVGO's 3.5D approach combines vertically stacked dies with the side-by-side packaging used to connect processors and HBM. It adds another direction in which designers can shorten the wires moving data around a chip. Besi describes Broadcom's initial face-to-face hybrid bonding at 6µm pitch. Huawei reports 1.5µm for its 2026 Kirin implementation. Pitch is the spacing between connections; face-to-face brings the dies' wiring surfaces together. On an identical square grid, that spacing difference allows 16x as many potential bond sites per unit area. Usable connections still depend on routing and the space reserved for power and repair. It is an architectural opportunity, not a bandwidth multiple. The size qualification matters. Kurnal's Kirin 9050 die shots measure roughly 121mm² per die. Extending fine-pitch bonding to much larger AI dies changes the economics: more expensive silicon is at risk when a stack fails, and heat and power delivery have to work across the whole assembly. Broadcom also said face-to-face compute SoC shipments began in February 2026. A later roadmap cannot be read as its first arrival at face-to-face bonding. Huawei looks ahead on this published pitch comparison. Our view is that this gives it a credible route to narrowing parts of the AI-chip gap through packaging. The stronger claim needs production evidence at large accelerator scale. The phone result alone does not establish when that arrives. Builds on Convequity's Huawei After Sanctions, Parts 1–2, 10 & 18 Sep 2026, with updated source checks.

CoStar: 3Q26 Business Recap

CoStar’s 3Q26 revenue growth slowed to 14% as bookings fell to $37 million, while cost cuts lifted EBIT margin to 8.8%.

ServiceNow Q3 FY12/26 Earnings Review

ServiceNow’s Q3 revenue rose 20.5% to $4.11 billion, while non-GAAP EPS missed consensus and fourth-quarter cRPO growth guidance slowed to…

Meta: A Clearer Roadmap

Meta's non-cancelable commitments reached $455 billion as FY26 capex approaches $140 billion, driving expense growth and 700-basis-point…

Why So Much Copper?

Amphenol and other copper-connectivity suppliers benefit as copper remains essential inside AI racks, where low-voltage, high-current power…

Publications we follow

Every publication on this site, hand-picked.

129 publications

Newsletters 109

X accounts we follow

Every account on this site, hand-picked.

91 accounts

Investor letters we follow

281 firms

Sectors

Ordered by how often our editor reaches for them.