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Tuesday, November 3, 2026

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TWLO Q3 FY12/26 Earnings Review

Twilio's Q3 revenue rose 20% to $1.56 billion, but Q4 organic growth guidance fell to 11% to 12% and RPO declined 28%.

TWLO $31B
Cestrian Capital Research 3 clicks

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@convequity 2 clicks

Convequity on X

The usual explanation for CoreWeave’s credit pressure is that its loans outlast its customer contracts. The filings say otherwise. All of $CRWV’s debt is due before its current contracts end, though only just: $14.6B of notes falls due in 2031-32, as the last contract cash comes in. That distinction matters. For a GPU cloud, debt that outlives its contracts is the dangerous kind. When a contract ends the chips are old, and there is no contract left to borrow against. CoreWeave’s real problem is speed. Each new build needs fresh capital before the last one has paid for itself, and almost all of the debt sits with the parent company. $IREN has the opposite shape. Its Microsoft project loan is matched to the contract. The risk is $6.3B of convertible bonds due 2031-33, mostly after its contracted cash has ended. If IREN’s stock is high by then, bondholders will likely swap the bonds for shares. If it’s low, IREN has to repay them in cash. Which leads to an odd conclusion: slower AI demand growth could help both. Fewer new commitments would give finished projects time to earn back their cost.
@convequity 1 click

Convequity on X

$UMC's nearer-term driver is its 12nm process with $INTC, and our longer-term view is that logic folding could make chips on its existing processes faster and more energy-efficient. UMC reports Q3 earnings tomorrow, while production is targeted for 2027 at Intel's Arizona factories. The partnership combines UMC's foundry experience with Intel's manufacturing capacity, giving UMC access to U.S. production without building an American factory. The immediate attraction is winning customers and expanding its business. Folding replaces long horizontal connections with shorter vertical ones, so signals need less time and energy to move. That could make chips built on established processes more capable without matching the newest transistor nodes. Older processes are, in our view, a more manageable starting point for this prospective thesis: UMC would still need to solve bonding, heat removal and reliable production, but it would not also be introducing a new transistor process.

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Stevanato down 30%. Yikes.

Stevanato fell 30% after forecasting low-single-digit 2027 growth as lower Nexa syringe volumes from a GLP-1 customer offset solid Q3…

STVN $5.4B
Best Anchor Stocks 3 clicks
BSP · short

Bending Spoons Spa

Bending Spoons is a software and digital-assets holding company that has completed more than 50 acquisitions since 2013.

BSP $29B
Value Investors Club 1 click

FTAI Aviation Update, Part Two

FTAI Aviation’s $234 million Jereh JV deposit funds Power inventory, while customer concentration, lower cash guidance and pending U.S.

FTAI $20B
CV's Substack 4 clicks

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