Bullpen.News From Edwin Dorsey
Get Daily Recap Feedback

Thursday, October 29, 2026

Back to today

Another Haircut with Avy the Barber

SoFi’s stock case hinges on interest rates, tangible book value and private-credit loan sales after its $1.5 billion equity offering.

SOFI $22B
WHAT ARE WE DOING? “Contrarians At The Gate” 3 clicks

From X

@convequity 2 clicks

Convequity on X

The usual explanation for CoreWeave’s credit pressure is that its loans outlast its customer contracts. The filings say otherwise. All of $CRWV’s debt is due before its current contracts end, though only just: $14.6B of notes falls due in 2031-32, as the last contract cash comes in. That distinction matters. For a GPU cloud, debt that outlives its contracts is the dangerous kind. When a contract ends the chips are old, and there is no contract left to borrow against. CoreWeave’s real problem is speed. Each new build needs fresh capital before the last one has paid for itself, and almost all of the debt sits with the parent company. $IREN has the opposite shape. Its Microsoft project loan is matched to the contract. The risk is $6.3B of convertible bonds due 2031-33, mostly after its contracted cash has ended. If IREN’s stock is high by then, bondholders will likely swap the bonds for shares. If it’s low, IREN has to repay them in cash. Which leads to an odd conclusion: slower AI demand growth could help both. Fewer new commitments would give finished projects time to earn back their cost.
@convequity 1 click

Convequity on X

$UMC's nearer-term driver is its 12nm process with $INTC, and our longer-term view is that logic folding could make chips on its existing processes faster and more energy-efficient. UMC reports Q3 earnings tomorrow, while production is targeted for 2027 at Intel's Arizona factories. The partnership combines UMC's foundry experience with Intel's manufacturing capacity, giving UMC access to U.S. production without building an American factory. The immediate attraction is winning customers and expanding its business. Folding replaces long horizontal connections with shorter vertical ones, so signals need less time and energy to move. That could make chips built on established processes more capable without matching the newest transistor nodes. Older processes are, in our view, a more manageable starting point for this prospective thesis: UMC would still need to solve bonding, heat removal and reliable production, but it would not also be introducing a new transistor process.

Investor Letters

All letters

CoStar: 3Q26 Business Recap

CoStar’s 3Q26 revenue growth slowed to 14% as bookings fell to $37 million, while cost cuts lifted EBIT margin to 8.8%.

CSGP $12B
Speedwell Memos 3 clicks

ServiceNow Q3 FY12/26 Earnings Review

ServiceNow’s Q3 revenue rose 20.5% to $4.11 billion, while non-GAAP EPS missed consensus and fourth-quarter cRPO growth guidance slowed to…

NOW $110B
Cestrian Capital Research 2 clicks

OSS Q3 FY12/26 Earnings Analysis

One Stop Systems grew Q3 continuing-operations revenue 36% to $12.6 million, raised FY2026 revenue guidance to $45 million, and used $11.8…

OSS $129M
Cestrian Capital Research 1 click

Meta: A Clearer Roadmap

Meta's non-cancelable commitments reached $455 billion as FY26 capex approaches $140 billion, driving expense growth and 700-basis-point…

META $1.6T
TSOH Investment Research 3 clicks

Why So Much Copper?

Amphenol and other copper-connectivity suppliers benefit as copper remains essential inside AI racks, where low-voltage, high-current power…

APH $196B
Jimmy's Journal 3 clicks

Publications we follow

Every publication on this site, hand-picked.

129 publications

Newsletters 109

YouTube 4

Blogs 15

Seeking Alpha 67 of 268

Nominate a publication

X accounts we follow

Every account on this site, hand-picked.

91 accounts
Nominate an account

Investor letters we follow

190 firms

Sectors

Ordered by how often our editor reaches for them.