ASML Is Building a Hybrid Bonding Tool!
ASML’s patent filings point to a track-based die-to-wafer hybrid bonding tool that could challenge Besi in advanced logic packaging.
ASML’s patent filings point to a track-based die-to-wafer hybrid bonding tool that could challenge Besi in advanced logic packaging.
$DELL down 20% in the last 2 days. If things get any worse we might have a Scott’s Tots situation on our hands https://t.co/GWR20XOft9
$CRWV CDS spreads hit new highs today, pricing in over a 60% chance of default within the next 5 years per bbg https://t.co/ABpSnUk8az
Reminder: $KSPI has nothing to do with KOSPI https://t.co/E9XdtsYHS5
$GME up 50% since this post as insiders scoop up shares hand over fist https://t.co/uKFkMe6jep https://t.co/peHc0ImMzs
@RAMCOCAPITAL That is exactly where I landed! I can see how this would appeal to Buffett even if Greg couldn't get his head around it. Although like the $SNOW IPO, maybe it was someone else who made the decision.
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