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Wednesday, October 28, 2026

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@StableBread 1 click

Fajasy on X

My bear, base, and bull cases value Boost Run’s $BRUN stock on year-end 2026 ARR (on the same basis as the multiples of CoreWeave $CRWV, Nebius $NBIS, and $IREN), which $BRUN will report with its Q4 results in March 2027. None of the three cases adds the $160.7M/year from the July order and Cohere, since both start in 2027. The peers’ contracts that start after 2026 aren’t in their year-end ARR either, so they’re priced into the multiples instead. Since the peers’ multiples leave out the debt they’ll take on to reach year-end ARR, I hold $BRUN’s net debt at today’s $244.3M, rather than adding the lease debt from its H2 2026 build. Each case’s value is year-end ARR times the multiple, minus the $244.3M of net debt, divided by the 88.8M fully diluted shares plus any new shares from a stock sale. I start with the $231.4M of ARR from contracts already running, then add (1) the June order’s $69.2M/year if it starts by December 31 and (2) however much of the $99.4M from contracts without disclosed terms is running by then. Bear case ($4.76, -46%) The bear case assumes $BRUN has no new financing to show by its Q3 report, lessors fund 70% of the H2 2026 build instead of 79.5% (below the 72.0% lessors funded in 2025), and the June order’s November 30 start slips into 2027, so 2026 GPU spending stays at the $1.0B low end of management’s range. That implies year-end ARR of $280M, 30% short of the target, a $62.2M stock sale at $8.89/share (7.0M new shares) to cover the funding gap and three months of 2027 payments, and today’s 2.5x, for a value of $4.76/share. I give the bear case about a 20% chance. Base case ($16.17, +82%) The base case assumes $BRUN lands new lease or asset-backed financing by year-end, starts the June order on November 30, and reaches its $400M target without selling stock. That implies $400M of year-end ARR at CoreWeave’s 4.2x, the median of the three peers, for a value of $16.17/share. I use today’s median, since the base case only solves $BRUN’s own financing problem. It assumes no relief on rates or borrowing costs, which would lift the peers’ multiples too. Bull case ($19.78, +122%) The bull case assumes everything in the base case, plus relief on rates and borrowing costs that lifts the peers’ multiples. That implies $400M of year-end ARR at 5.0x, still below Nebius’s 5.9x, for a value of $19.78/share. So the bull case is really a bet on the market, not on anything more from $BRUN. From $8.89/share, you’re risking a $4.13 loss (-46%) in the unlikely bear case for a $10.89 gain (+122%) in the more likely bull case. P.S. These cases use the October 16 close and predate $BRUN’s October 26 release, which says it has closed more than $600M of non-dilutive project financing in 2026.
@convequity 2 clicks

Convequity on X

Investors are selling $BESI, in our view, because customers increasingly prefer or consider shorter HBM stacks, since HBM is expensive. Our industry information points to customers requesting stacks of four or six memory dies. Fewer layers mean fewer connections and, where hybrid bonding is used, fewer bonding steps per stack, and shorter stacks fit package-height limits more easily with conventional solder. That could delay equipment adoption and weaken the nearer-term HBM opportunity for $BESI, which supplies hybrid-bonding equipment. Logic folding is the tailwind. It places parts of a circuit above one another on vertically connected layers joined through hybrid bonding, so signals travel shorter distances and the chip runs faster on less energy. Those benefits hold even when an inference system needs less HBM, and the layers still need aligning and connecting with exceptional precision. In our view, that can create more hybrid-bonding demand than this delay takes away. Wider folding also pushes inspection and measurement into more logic-chip applications. We expect that to lift spending faster than chip volumes for $ONTO and $CAMT, and for $NVMI, whose materials and chemistry checks address problems that get harder as circuits move into vertically connected layers. Longer term, folding could make chips on established processes more capable for $UMC. That is our prospective thesis, not an announced UMC program. Deeper dive available at Convequity.

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