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Everything our editor has picked under this sector, best first.

137 stories

GLP-1 winners and losers

GLP-1 drugs are gaining traction across Asia as Chinese developers advance candidates and Indian generics slash prices, reshaping prospects…

NVO $172B
Asian Century Stocks 3 clicks
@convequity

Convequity on X

Kirin 9050 Pro is the first Tau Scaling chip. The bigger story is Ascend. Huawei just put LogicFolding in the Mate XT 2. First commercial SoC on the Tau (τ) law He Tingbo laid out in May / updated in July. Not a surprise if you read that paper. Still a real jump: DUV + SAQP + logic stacking took density from 155 → 238 MTr/mm² on the same SMIC N+3 node. +55% in one gen. Power went down, not up. That’s N3-class equivalent density. Headline number matches Intel 18A HD (238) and sits next to Samsung SF2 (~231). TSMC N2 HD is still ahead (~313). Caveat: 238 is Huawei’s LogicFolding equivalent, not a planar N3 shrink. Same device node as 9030 Pro. Some analysts put the industry-formula read closer to ~175. Mobile scoreboard vs last-gen trifold / 9030 Pro: • Device +42% • CPU ST +24% / MT +52% • P-core 3.1 GHz (was 2.75) • CPU / GPU / NPU iso-perf power −41% / −58% / −66% • GPU render +142% • On-device 30B-total-param MoE Multi-core still trails $QCOM’s latest. The gap is no longer multi-generation. Next Tau Kirin can catch, maybe pass, a leading-edge mobile SoC. The packaging tell is sharper than the phone benches. 1.4–1.5μm hybrid-bond pitch. ~50M vertical interconnects. Western HVM hybrid bonding is still ~6μm (TSMC SoIC) to ~9μm (Intel Foveros Direct). If 1.4μm holds, that is SOTA vs Western leading-edge bonding — not the Geekbench print. Phone catch-up is the demo. AI silicon is the payoff. Apply the same fold to Ascend and the process-density gap vs $NVDA peers compresses from the lithography side over the next few quarters. Remaining bottlenecks: domestic DUV tool volume, HBM, packaging, software. I wouldn’t assume they outproduce ASML on DUV. I also wouldn’t fade the direction. Mature DUV + stacking + almost-unlimited power is enough to put China in the token-factory fight vs the US. Tables below. 🧵
@KEDM_COM

KEDM.com on X

Chinese stockbrokers FUTU $FUTU and Up Fintech $TIGR are taking a beating after the Chinese securities regulator ordered all unauthorized Mainland accounts to be closed within 2 years, with only sell orders and fund withdrawals allowed. Both companies will be fined, but a rumored 1.85b CNY fine for FUTU is less than 2 months of profit. For FUTU, mainlanders are 13% of accounts but closer to 20% of total assets and revenue. FUTU's rapid growth in HK and SE Asia has diversified the business in recent years, and the loss of Chinese customers is less than 1 year's worth of customer growth outside China. What remains is a faster-growing, HK/SE Asia consumer play with no China risk, which probably trades at 8x P/E with net cash. That is, if this was the last shoe to drop and Mother China isn’t intent on ruining them.
TOYO · short

Toyo CO LTD

TOYO CO LTD is the target of a short thesis.

TOYO $176M
Value Investors Club

Trip.com (TCOM US)

Trip.com dominates China’s online travel market with over 50% share and has grown international platform traffic from 1 million monthly…

TCOM $25B
Asian Century Stocks